TE Connectivity 6376818-1 Applies To: Printed Circuit Board Centerline (mm [in]): 1.00 [0.039] Color: Black Connector Style: Header - Receptacle Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Housing Material: Thermoplastic - GF Housing Material Temperature: Standard Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Mating Connector Lock: Without Mount Angle: Right Angle Number Of Positions: 38 Packaging Method: Tray Panel Mount Retention: With Pcb Mount Retention: With Pcb Mount Retention Type: Boardlock(s) Product Series: Series II Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Shell Material: Copper Alloy Shell Plating: Tin Solder Tail Contact Plating: Tin over Nickel